Process and materials characterization and diagnostics in IC manufacturing

27-28 February 2003, Santa Clara, California, USA

Publisher: SPIE in Bellingham, Wash., USA

Written in English
Cover of: Process and materials characterization and diagnostics in IC manufacturing |
Published: Pages: 222 Downloads: 741
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  • Integrated circuits -- Design and construction -- Congresses.,
  • Integrated circuits -- Defects -- Analysis -- Congresses.,
  • Semiconductors -- Design and construction -- Congresses.,
  • Semiconductor wafers -- Defects -- Analysis -- Congresses.,
  • Integrated circuits industry -- Quality control -- Congresses.,
  • Quality control -- Congresses.

Edition Notes

Other titlesDesign, process integration, and characterization for microelectronics.
StatementKenneth W. Tobin, Jr., Iraj Emami, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.
SeriesSPIE proceedings series,, v. 5041, Proceedings of SPIE--the International Society for Optical Engineering ;, v. 5041.
ContributionsTobin, Kenneth W., Emami, Iraj., Society of Photo-optical Instrumentation Engineers.
LC ClassificationsTK7874 .P754 2003
The Physical Object
Paginationx, 222 p. :
Number of Pages222
ID Numbers
Open LibraryOL3323609M
ISBN 10081944846X
LC Control Number2004296392

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